| Specification | Value |
|---|---|
| Max. no. of Layers | 24 |
| Max. Board Size (L x W) |
430 x 585 (For SS & DS) 415 x 565 (For Multi layers) |
| Max. Board Thickness | 3.20 |
| Min. Finished Board Thickness | 0.20 (No HAL / Masking) |
| Specification | Value |
|---|---|
| Base Material | FR4 |
| Inner Layer Copper Cladding | |
| Max. Cu Wt. For Planes (Oz.) | 2 |
| Max. Cu Wt. For Signals (Oz.) | 2 |
| Min. Cu Wt. (Oz.) | 0.5 |
| Max Cu Wt. (Oz.) | 3 |
| Min Cu Wt. (Oz.) | 0.5 |
| Specification | Value |
|---|---|
| Min. Finished via Hole Size | 0.10 |
| Min. Finished via Pad Size | |
| Outer Layers | 0.40 |
| Inner Layers | 0.45 |
| Min. Annular Ring | 0.10 |
| Drill to Drill Clearance | 0.15 |
| Min. Slot Size For PTH Slots (Tool size) | 0.50 |
| Blind & Buried vias Manufacturable | Yes |
| Drill to Track Clearance For Inner Layers (upto 6 layer) | 0.25 |
| Drill to Track Clearance for Inner Layers (>6 layer) | 0.35 |
| Min. Drill Size For Plated Holes on Board Edge | 0.80 |
| Min. Drill to Drill Clearance For Plated Holes on Board Edge | 0.80 |